At the highly anticipated Advancing AI 2024 event, AMD introduced its roadmap for cutting-edge AI accelerators, highlighting the MI325X and MI355X models. These new offerings are set to bolster AMD’s competitive edge in the AI space, with Taiwan Semiconductor Manufacturing Company (TSMC), AMD’s long-time chip production partner, positioned to benefit significantly, according to reports from Commercial Times and Economic Daily News.
TSMC, known for its advanced packaging technologies like chiplets and CoWoS, is expected to play a pivotal role in the production of these AI accelerators. The collaboration is anticipated to drive substantial gains for TSMC as it continues to provide manufacturing and packaging services for AMD’s AI chips.
Other key players in the Taiwanese supply chain are also expected to see growth. ASMedia, which supplies PCIe Gen5 high-speed interface chips, along with ASIC design firms GUC and Alchip, are likely to benefit from the production surge. In the server market, companies like Compal, Wistron, Wiwynn, and Inventec are among AMD’s strategic partners for delivering these AI-powered solutions.
AMD’s Instinct MI325X AI accelerator, which is being produced using TSMC’s 4nm and 5nm process nodes, is set for mass production this quarter. This model will be the first to feature 256GB of HBM3e memory, marking a significant leap in AI GPU technology, according to Wccftech.
To rival NVIDIA’s dominant GB200 chip, AMD also unveiled the MI350 series. The MI355X, expected to launch in the second half of 2025, will leverage TSMC’s 3nm process and pack 288GB of HBM3e memory, offering an impressive 35x boost in FP8 computational performance thanks to the CDNA 4 architecture, Commercial Times reports. This places AMD in a strong position to compete with NVIDIA’s Rubin AI chips, which are expected in late 2025.
AMD’s existing AI solutions, such as the MI300X accelerator, have already seen adoption by major tech companies, including Microsoft and Samsung. Notably, Samsung recently purchased $20 million worth of MI300X units for AI training, signaling strong market confidence in AMD’s AI product lineup.
At the event, AMD also introduced its latest EPYC 9005 Series server processors, built on the “Zen 5” architecture. These processors offer up to 192 cores and are designed for a variety of platforms from leading OEMs and ODMs. Manufactured using TSMC’s 3nm and 4nm nodes, the EPYC 9005 Series aims to deliver unmatched performance for enterprise and data center applications.
With TSMC’s advanced manufacturing capabilities and AMD’s innovations in AI and server technologies, both companies are well-positioned for continued success in the rapidly evolving tech landscape.
Reference: Trendforce